Products
Contact Us
- Contact Person : Mr. Jie Wang
- Company Name : Zhejiang Gpilot Technology Co., Ltd tod
- Tel : 86-577-57127050
- Fax : 86-577-55775833
- Address : Zhejiang,Yueqing,No. 397 JingBa Road, Yueqing Economic Development Zone, Yueqing, Zhejiang, China 325600
- Country/Region : China
- Zip : 325600
Products List
Gold 4N Bonding Wire
Gold 4N bonding wireFor the outstanding chemical and mechanical properties, pure gold bonding wire is a ideal material connecting chip to substrate, is one of the key materials in semiconductor encapsulation industry. Over 13 years experience, strict and standard production procedure, 100 class purification workshop, Gpilot guarantees the quality...
High Purity 99.99% Gold Bonding Wire
High Purity 99.99% Gold Bonding Wire:Gpilot’s 4N 99.99 gold bonding wire with excellent electrical conductivity and chemical stability, good squashed ball shape and bondability, suitable breaking load and elongation -- the best choice of packaging material to the semiconductor industry.Download certificategold wire-2014REACH.PDFgold wire-EU...
80% High Content Gold Bonding Wire
80% High Content Gold Bonding Wire:Gold bonding wire with excellent electrical conductivity and chemical stability, good squashed ball shape and bondability, suitable breaking load and elongation. Special bonding wire is a kind of new wire Gpilot developed for customers to reduce the cost while keeping the gold bonding wire’s outstanding...
Gold 4N Bonding Wire
Gold 4N bonding wireFor the outstanding chemical and mechanical properties, pure gold bonding wire is a ideal material connecting chip to substrate, is one of the key materials in semiconductor encapsulation industry. Over 13 years experience, strict and standard production procedure, 100 class purification workshop, Gpilot guarantees the quality...
High Purity 99.99% Gold Bonding Wire
High Purity 99.99% Gold Bonding Wire:Gpilot’s 4N 99.99 gold bonding wire with excellent electrical conductivity and chemical stability, good squashed ball shape and bondability, suitable breaking load and elongation -- the best choice of packaging material to the semiconductor industry.Download certificategold wire-2014REACH.PDFgold wire-EU...
60% Gold Content Bonding Wire
60% Gold Content Bonding Wire:Pure gold bonding wire enjoys the perfect mechanical and chemical properties for bonding, but the cost is high. 60% Gold content bonding wire is composed of 60% Au and 40% Ag, Gpilot trys to keep the good performance of the gold wire as much as possible but reducing the cost for our customers.Download...
Au Coated Ag Alloy Bonding Wire
Silver Alloy Bonding Wire:Silver alloy bonding wire as an alternative to gold wire, it has been useful to eliminate the drawbacks of silver wire and has the similar wire bonding properties to gold wire. Considering its low cost and highly reliable performance, silver alloy wire will be more popular and widely used in packaging industry.Download...
80% High Content Gold Bonding Wire
80% High Content Gold Bonding Wire:Gold bonding wire with excellent electrical conductivity and chemical stability, good squashed ball shape and bondability, suitable breaking load and elongation. Special bonding wire is a kind of new wire Gpilot developed for customers to reduce the cost while keeping the gold bonding wire’s outstanding...
Palladium Coated Copper Bonding Wire
Palladium Coated Copper Bonding Wire:Because of the noble metal protection,Website:http://www.gpilot-bondingwire.com, palladium coated copper bonding wire provides better corrosion protection of the copper core of the wire and improvement in...
Mixed Au And Ag Alloy Bonding Wire
Mixed au and ag alloy bonding wire:Considering its low cost and highly reliable performance which has the similar wire bonding properties to gold wire, silver alloy wire is more and more popular and widely used in packaging industry.Gpilot has two kinds of silver alloy bonding wire -- Au Coated Ag Alloy Bonding Wire and Mixed Au & Ag Alloy Bonding...